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simon_sun:印刷这边目前也就点锡,点胶,或者3D钢网SPI没啥太大变化贴片的话看设备能力了,工艺看板子设计堆叠类似POP,FP,贴die,贴插件,贴大模块。。焊接就回流焊,真空回流焊,真空气相焊炉前炉后AOI没啥变化,炉后AOI双面检测....... (2021-08-09 10:08)
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simon_sun:顺便补充一下最近比较火的SIP工艺吧目前SIP有纯SMT的,也有SMT和WB FC混装的纯SMT的没什么太大区别,就是产品密度相当高,而且元器件和焊盘设计也都比常规的要小,基板厚度基本都是0.3mm的SMT与WB/FC混装的就多了晶圆切割(SAW),贴装晶圆(Die attach),引线键合(Wire Bon .. (2021-08-12 15:02)