 |
 |
panda-liu
No.: 002622
     
级别: VIP

头衔: 退役的巴顿

发帖: 9507

精华: 20

威望: 208 点

金币: 588 枚

贡献: 71 点

好评: 123 点

来自: 扬子江畔石头城

在线状态:
离线

注册时间: 2003-05-16

最后登陆: 2008-11-22

| |
 | |
 |
|
#8楼说:
 |
|
 |
|
无铅(Lead Free)常见问题 为何推动无铅化进程? 安森美对于"无铅"的定义是什么? 贵公司的无铅产品开发进程是什么? 能否提供关于产品供货及鉴定时间表的详细信息? 为了证明无铅器件的可靠性,让它在260℃的高温下回焊加工处理,需要进行何种技术指标测试? 无铅器件将采用何种材料电镀抛光? 如果我们尚未准备转换使用无铅产品,是否可以继续购买锡铅合金抛光电镀的产品?这一情况可维持多久? 购买无铅器件是否有额外的成本?无铅封装是否会更贵? 在购买现货或进货时,怎样区分含铅产品或无铅产品? 客户应向谁提出无铅封装的需求?订货和取样? 如果100%采用锡电镀抛光,安森美采用什么合格性测试来估计锡晶须的发生率? 为什么100%锡电镀液会存在晶须生长的问题? 经过转换至无铅器件转换后安森美的产品还会含铅吗? 安森美对于减少产品中其它的非环境友好化合物还有哪些计划? 客户使用无铅器件的过程是否需要作出改变? 如果在公布的无铅化进程开始前我需要无铅产品,应怎样做呢? 在根据公布的无铅化进程业提供无铅产品后,如果我还想继续使用含铅产品应怎么做呢? 无铅组分是否同锡铅焊膏兼容呢? 订货时怎样区分含铅产品和无铅产品?它们有不同的产品型号吗? 产品标记会有所改变吗? 如何得知我定购的样品是否含铅? 无铅封装与现有的封装在质量和可靠性标准方面是否有所差别? 现有的锡铅电焊产品是否都可承受高达260℃的回焊温度? 怎样辨别无铅产品和可以承受260℃高温回焊温度的产品? 如果客户有任何疑问应向谁咨询? 何处可以得到有关产品化学物质含量小册子的最新版本? 客户可否查看公司数据表以辨别何种产品是无铅的? 这会影响器件的MSL(潮度敏感度)额定值吗?区别是什么?
安森美半导体 http://www.onsemi.com/site/content/0,4367,1284,00.html?lang=zh#n
Site Map
Home
About NEMI
Members NEMI Leadership History FAQ What people are saying
Newsroom
Press Releases Presskits Facts & Figures ___Fact Sheet ___History ___FAQ Members Bios & Photos Articles & Whitepapers ___Lead-Free Assemblies .... Tin Whiskers ___Factory Information Systems and Supply Chain Communication ___Interconnect Substrates ___General/Opinion ___Board/Package Assembly - Process, Materials and Infrastructure ___Optoelectronics Presentations & Reports Annual Report
Roadmapping
Impact of NEMI Roadmaps Current Roadmap 2000 Roadmap
Projects
Board Assembly TIG ___Test Strategy (completed) ___Fiber Optic Splice Improvement ___DPMO (Defective Parts per Million Opportunities)
Environmentally Conscious Electronics (ECE) TIG ___Lead-Free Assembly and Rework ___Tin Whisker Accelerated Test ___Tin Whisker Modeling .....Tin Whisker User Group ___Lead-Free Assembly (completed) New Initiatives: .....RoHS Transition Task Group .....Assembly Process Standards .....Component and Board Marking .....Component Supply Chain Readiness .....Materials Declarations
Product Lifecycle Information Management (PLIM) TIG ___Product Data eXchange (PDX) extensions & updates ___IPC-2577 ___PDX 2.0 ___Environmental regulations & data exchange ___Data Exchange Convergence (completed) ___Virtual Factory Information Interchange (completed) ___Plug & Play Factory (completed)
Optoelectronics TIG ___Fiber Optic Signal Performance ___Fiber Handling (completed) New initiatives: ___Optoelectronics for Substrates Study
Substrates TIG ___High Frequency Material Effects on HDI Formation ___Advanced Embedded Passives Technology (completed) New initiatives: ___Embedded Resistor and Capacitor Testing
Standards
Assembly Components & Subsystems Information Management
Join NEMI
Why Join? Membership Requirements & Fees NEMI Organization Getting Involved Intellectual Property Policy Membership Application Project Participation Agreement NEMI By-Laws
Calendar
Member Site
Contact Us
Contact Information Staff Directions
NEMI http://www.nemi.org/sitemap.html
|
|
 |
|
 |
|
※ 本文为 panda-liu 个人意见,不代表SMTHome.Net立场 ※
|
|