DEK频频推出新技术产品

DEK频频推出新技术产品 [ 转自SMT之家论坛 http://bbs.smthome.net ] #}Ays#wA>?  
3z8zZ1uzU  
DEK公司最近频频展示新推向市场的设备和技术。 }ASBP:c"t  
!yV)EJ:$  
·DEK将于3月17-19日在上海举行的Semicon China展出半导体先进封装应用的工艺和机器解决方案（7号展馆7808号展台），包括晶圆凸块、基板凸块、晶圆和基板植球、晶圆背面环氧树脂涂敷，以及FCD工艺。其中包括首次在亚洲展示的DEK全新高阶微米级Galaxy网板印刷平台，它具有可追溯特性和10微米精度优势，拥有高产量、高精度批量挤压印刷特性。 :4COPUBpPV  
[ 转自SMT之家论坛 http://bbs.smthome.net ] -**fT?n  
·DEK在四月的上海Nepcon展会期间（1E07展台），将展出的印刷机平台包括：增添了更多功能和选择的Horizon ，以及专为需要灵活半自动印刷机的用户而设，兼具高精度和高良率的248SA。 BMhuM~?(  
uuCVI2|  
·DEK的100%通孔填充工艺（Via Fill Process）赢得Apex 2004技术创新奖（Innovative Technology Showcase Award） Z \-  
fK=vLcH  
The IPC Association recently commended DEK's technological advances with its new Via Fill process. Awarded a slot in the Innovative Technology Showcase at the APEX exhibition in Anaheim, California, DEK's 100% fill technology was described by the judges as 'groundbreaking'. [ 转自SMT之家论坛 http://bbs.smthome.net ] $5>x)jr:w+  
bHHR^*B  
As part of the Innovative Technology Showcase at APEX, DEK's Via Fill process that delivers 100% fill of substrate vias with no voids and minimal surface residue, will demonstrate what the IPC describes as 'new and emerging technologies'. This Pro-Flow- based process offers solutions to problems such as insufficient fill, voiding, poor throughput and excessive handling of product associated with conventional methods. Z,b^f Vw  
Mz6|#P}.s  
The fully enclosed ProFlow head is used in conjunction with a dedicated tooling fixture that ensures complete fill of via's in the minimum of print passes (typically two), with a paste pressure of 2.5 bar and a print speed of 25mm/s. In addition, the print material has been shown to have a life of over three months in the transfer head. <^8OYnp  
[ 转自SMT之家论坛 http://bbs.smthome.net ] sM%.=
~AN  
·另外， DEK最新推出Eform电镀网板制造技术VAHT(Variable Aperture Height Technology)，提供独特和复杂的电镀模板孔穴高度控制技术，大大提高焊锡印刷的性能，提高了其设备应对诸如无铅等各种挑战的能力。 MK4CggoC  
jY\YSQ  
Eform stencils provide superior performance and ensure seal contact to the pad(s), pad paste deposit and a greater percentage volume of paste on pad. The reactive force created by DEK Eform stencils provides for an even distribution of paste and allows for a more clean release of paste from the aperture. This technology also delivers ultimate control over stencil thickness and uniformity, ensuring outstanding paste volume consistency for fine pitch applications. And, as the electronics industry moves ever closer to the reality of lead-free manufacturing, DEK Eform stencils will become a necessity, as they improve solder paste release for some of the more challenging lead-free solder paste formulations.