[重要] 合金状态图（英、日、韩）！！！ SMT之家论坛|SMT|Surface Mount Technology|表面贴装技术

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标题: [重要] 合金状态图（英、日、韩）！！！

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panda-liu
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楼主说: [重要] 合金状态图（英、日、韩）！！！


	http://www.metallurgy.nist.gov/phase/solder/solder.html http://web.met.kth.se/dct/pd http://www.crct.polymtl.ca/fact/xmltree/pdTree.php?expand=1 http://www.icm.re.kr/mdb/phase/index.jsp?ca=2&index=A http://www.geocities.jp/stkyjheiwa/phase.pdf http://www.asminternational.org

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2004-05-23 19:10

panda-liu
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#1楼说:


	Section 1 - Solder Reflow Basics Section 2 - Printed Circuit Board Fabricaion & Solderability Section 3 - Reflow Profiling Section 4 - Nitrogen Inert Atmosphere Reflow Section 5 - Reflow Oven Heat Transfer Section 6 - Reflow Oven Convection Methods Section 7 - Choosing Your Reflow Oven Section 8 - Oven Price vs. Cost of Ownership Section 9 - Vertical Reflow Multitasking PCB Production Section 10 - Semiconductor Reflow Section 11 - Research International Thermal Solutions http://www.research-intl.com/reflowtechbook.htm

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2004-05-23 20:47

panda-liu
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#2楼说:


	PCB Assembly Links-Directory 0 0201 Sized Components A Adhesive Printing Adhesives AOI B Baking Ball Grid Arrays Bare Boards Bob Willis Defect Browser Books C Capacitors Cleaning Codenumbers Component Manufacturers Conductive Adhesives Conductor Finishing Connectors Contacts Controlled Impedance CSP D DFM Dispensing Dummy Components E Electroplating Equipment Surveys ESD Excellon Drill Files F Finishing Flip-Chip Flux Footprints Forums G Gerber H Hand Soldering HASL I Intermetallics Intrusive Reflow IPC J JEDEC L Laminates Land Patterns Laser Polishing Lead-Free M Magazines Manual Soldering MCM Metal Finishing MIL-specs Moisture Sensitivity Moonman N No-Clean Technology P Packaging Part-Numbering Pick and Place Pin In Paste Soldering R Reballing Recent Additions Reflow Soldering Reliability and Reliability Testing Repair and Rework S Selective Soldering Sipad SMT-Net Software Solder Alloy Solder Paste Solderability Solderballing Soldering Soldering Defects Soldering Materials Soldermask SPC SRTS Standards Statistical Techniques Stencil Printing T Testing Thermal Profiling Through-Hole Assembly Tin Tombstoning U Underfilling V V-Scoring Various PCB Assembly Links VOC-free Soldering W Wave Soldering Wire Bonding Wire Tacking X X-ray Inspection http://www.smtinfo.net

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2004-05-23 20:52

panda-liu
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	Index Bob Willis Homepage Bob Willis Defect Browser http://www.bobwillis.co.uk/defect_browser/index.htm

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2004-05-23 21:26

SMTLover
No.: 002679

级别: Mod

电子辅料、耗材、电子设备、配件供应商：东莞亚特电子

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#4楼说:

Panda提供的信息总是如何经典！

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2004-05-24 01:02

pillarli
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望友科技提供GC-PowerPlace专业培训及相关服务

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#5楼说:

怎的也要说一声谢谢!!!
:em02

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2004-05-29 06:22

darknight
No.: 006680

望友科技提供GC-PowerPlace专业培训及相关服务

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#6楼说:

我们什么时候可以学到老刘的水平啊？^鼓掌:nosweat:

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2004-06-06 18:45

panda-liu
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SMT胶粘方案探讨，SMT电子胶水答疑，请上电子胶水论坛A4E！

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#7楼说:


	1教授+1博士后+2博士的经典之作（中文的）...。:em33 CHALLENGES FOR THE APPLICATION OF LEAD-FREE SOLDERS ON BALL GRID ARRAY PACKAGES Abstract The adoption of Pb-free solders in lieu of Pb solders is an inevitable trend in the electronics industry. This study sums up the failure modes to which the ball grid array packaging process is susceptible when various Pb-free solders, such as Sn-3.5Ag, Sn-0.9Cu, Sn-58Bi, Sn-51In, Sn-20In-0.8Cu, Sn-20In-2.8Ag, Sn-4Ag-0.5Cu, Sn-3Ag- 0.5Cu and Sn-4Ag-5Cu, are employed. Examples of potential failure modes include: intermetallic embrittlement, gold embrittlement, void formation, Ag3Sn plate formation, pad lifting, Sn-Bi joint degradation caused by Pb contamination, fatigue-induced ductile/brittle transition, Ag thick film dissolution, and non-wetting due to precipitation. Keywords: electronic packaging, lead-free solders, BGA package, failure analysis. 1/2

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2004-06-07 10:39

panda-liu
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电子辅料、耗材、电子设备、配件供应商：东莞亚特电子

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#8楼说:


	1教授+1博士后+2博士的经典之作（中文的）...。:em33 2/2

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2004-06-07 10:40

panda-liu
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VayoPro-View Expert免费试用/GC-PowerPlace免费培训

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#9楼说: 一些有用的网站...


	ＥＵのＰｂ関係規制情報（ＲＯＨＳ等）リンク

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2004-06-08 15:04

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