[转载]SnBiAg可靠性测试和失效分析（E论文） [复制链接]

Reliability Test and Failure Analysis of High-Density Packages with a Low-Temperature Lead-Free Solder (SnBiAg)


Abstract
The High Density Packaging Users Group Consortium (HDPUG) has conducted a study of process development and solderjoint
reliability of high-density packages on printed circuit boards (PCB) using a low melting temperature lead-free solder.
The design for reliability, materials, and assembly process aspects of the project have been discussed in a companion paper,1
“Design, Materials, and Assembly Process of High-Density Packages with a Low-Temperature Lead-Free Solder (SnBiAg)”,
which is also published in these proceedings. In this study, reliability tests (e.g., temperature cycling and shock & vibration)
and failure analysis of high-density packages on PCB with the low melting temperature lead-free solder (Sn-57wt%Bi-
1wt%Ag) are investigated.

Very useful . Thanks .