[转载]Reliability Testing Results of NEMI [复制链接]

Reliability Testing Results of Surface Mounted Lead Free Soldering Materials and
Processes

Abstract
The world-wide movement to phase out lead from electronic products presents many challenges for companies throughout
the electronics supply chain. The University of Massachusetts at Lowell has brought together many Massachusetts/New
England firms to collaborate on the manufacture and testing of lead-free printed wiring boards (PWBs). The results of the
first set of experiments, published in 2001, showed that zero-defect soldering is achievable with lead-free materials.
Following thermal cycling, the PWBs were visually inspected and the leads were pull-tested for reliability analysis. They
compared favorably to a baseline of lead soldered PWBs
A follow-on design of experiments was created in 2002 and a second set of test PWBs was made and tested in 2003. Three
lead-free solder pastes based on Sn/Ag/Cu alloys were reflowed using either air or nitrogen with five PWB surface finishes,
four component types with two types of component finish. Visual inspection and pull-testing were performed and published
as completed in APEX, SMTI and IEEE conferences. This paper summarizes the testing results and introduces further
research plans in volume manufacturing of lead free PWBs for the phase III testing sponsored by the EPA.

Thanks for your great information. I like this report for my reference.