QUOTE:
原帖由0楼楼主 mailrapid 于2007-12-26 15:57发表 
當我們講到Wire Bonding，我們知道是用"金線"，
但為什麼不用銀線或銅線呢？
I search from Internet with different Wire Characteristics comparison [ Enclosed Photo] :
http://www.kns.com/KNSNew/Templates/showpage.asp?TMID=84&FID=488
1) Gold
2) Copper
3) Alminum
For Gold Wire 金線, it has been engineered to achieve low, consistent loop profiles for consistent impedance in high frequency applications. It exhibits excellent bondability on the widest range of semiconductor materials and contact metallizations, as well as substrate metallizations. Superior tail consistency rounds out the capabilities of this very versatile bonding wire.
For the IC, we always use Gold Wire 金線.
For the COB, we always use Aluminum Wire
For Copper Bonded Devices: 铜线焊接
http://www.knschina.com/prodserv/copper/index.asp
铜焊器件带来新的成长机遇！
铜线焊接器件不仅成本低廉，而且性能具有诸多优势，对此类器件的需求已不仅限于封装I/O数量较少的功率器件，而且拓展到了BGA及QFP等高管脚数封装。为什么铜技术在显著降低封装成本的同时，还能够改善性能和可靠性呢
为什么要采用铜线焊接？
铜线的导热导电性能显著优于金线和铝线，因此能够以更细的焊线直径达到更好的散热性能及更高的额定功率。与金相比，铜的机械性质更强，这样在模压和封闭过程中可以得到优异的球颈强度和较高的弧线稳定性。
SMT之家论坛 -> COB-邦定制程 -> 為什麼Wire Bonding用金線？
