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楼主说:
铟泰公司在NEPCON South China展出重大成果:Indium8.9焊锡膏
Indium8.9免洗无铅焊锡膏是在空气中进行再流焊的焊锡膏，它的各方面性能比至今制造的任何无铅焊锡膏都好，用起来像是锡铅焊锡膏。 Psr\$js{2
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随着CSP、0201 和01005技术逐渐成为主流技术，印刷电路板组装商面临着焊锡膏从模板小孔中脱模的挑战。在面积比低于行业建议的最小数值0.66时，Indium8.9通过模板开孔印刷到板上的体积仍然保持一致。 AdDHKt/
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对于移动电话一直到主机板，Indium8.9的效果都很好。对于使用焊盘中导通孔技术的BGA，在用不同的温度曲线焊接时，Indium8.9的空洞少（<5%）。它的工艺窗口也很宽，能够减少可能出现的缺陷，而且适用于各种尺寸的板，在产量方面也能达到要求。 ^[bIIB
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在安装BGA器件时，使用Indium8.9可以消除焊点断裂的缺陷，因而提高了第一次通过所有测试的合格率，并且减少在现场发生的故障。这种焊锡膏正是针对这些要求而设计的。它的热稳定性极好，再流焊后的残留物是柔软的。它的这个优点表示使用探针的可测性较好，在进行再线测试时误报较少。 Vup}424 /
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由于Indium8.9在性能方面有这些益处，客户使用它时可以降低成本，提高成品的可靠性。 Ge1 k5
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铟泰公司的展台设在1B50。 ~M Qd8yz)
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有关Indium8.9的详情，请访问网页http://www.indium.net.cn/big.htm 或发电邮到abrown@indium.com。 :=hxH31
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Indium8.9 Pb-Free No-Clean Solder Paste is an air reflow solder paste that performs like SnPb by delivering more performance features than any Pb-Free solder paste ever made. mG;-3n?
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As CSP, 0201, and 01005 technology is becoming more mainstream, PCB assemblers are challenged with achieving high solder paste transfer efficiency through small stencil apertures. Indium8.9 was formulated to produce consistent print volumes through apertures below the industry recommended minimum area ratio of 0.66. 'BWrNg#|<
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From cell phones to Mother Boards – Indium8.9 does it all. Indium8.9 exhibits low voiding (<5%) over many different profiles when soldering BGAs with via-in-pad technology. It also offers a very robust processing window that can minimize potential defects, as well as accommodate various board sizes and throughput requirements. <aO7gC6t
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Indium8.9 was specially designed to improve first-pass yields and reduce field failures when mounting BGA devices by eliminating “head-in-pillow” defects. It also offers the benefit of being extremely thermally stable and maintaining a soft, pliable residue after reflow. This means easier probe-testability and fewer false rejects during in-circuit testing. mZ6M!bon S
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The performance benefits customers obtain by using Indium8.9 result in increased cost savings and the highest finished goods reliability. 7YL<t$MK$[
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Indium will be exhibiting at Booth 1B50 8Qjhe\ i}s
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For more information about Indium8.9, visit http://www.indium.com/big or email abrown@indium.com
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SMT之家论坛 -> 电子业界动态 -> 铟泰公司在NEPCON South China展出重大成果:Indium8.9焊锡膏
