QUOTE:
原帖由0楼楼主 安皮皮 于2008-09-27 00:09发表 
在用X光检测BGA焊点时的一些专业英语术语,高手帮翻译下
1 BGA Open Circuit/open joint
2 Wicking of BGA Solder Balls
3 BGA Popcorning/Cracking
4 BGA Co-planarity Issues
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1 BGA Open Circuit/open joint BGA开放电路或开口接合
2 Wicking of BGA Solder Balls BGA锡球连接状态
3 BGA Popcorning/Cracking BGA 表面起泡或崩裂
4 BGA Co-planarity Issues BGA 虚焊问题
5.Missing Balls 缺掉球
6.Incomplete Refolw 残缺不全熔接
7 Misalignment of BGA Package BGA封装包装的不同密度
8 Inconsistent Ball Size Variation 球大小不一的连接效果
9 Champagne Voiding 无
10 Solder Shorts/Bridges 连接短路或桥段连焊
我也不自己翻译得对不对!限供参考 不好意思LZ