[分享]MOTOROLA COMPONENT PADSTACK SPECIFICATION(UPDATA:2005) [复制链接]

MOTOROLA COMPONENT PADSTACK SPECIFICATION
TABLE OF CONTENTS Page Number
Section
1. PURPOSE.......................................................................................................................................................................5
2. SCOPE............................................................................................................................................................................5
3. RESPONSIBILITIES .......................................................................................................................................................5
4. REFERENCE ..................................................................................................................................................................6
5. DEFINITIONS..................................................................................................................................................................6
6. PADSTACK/GEOMETRY SEARCH AND SELECTION PROCESS ...............................................................................9
7. CE APPROVED PADSTACKS......................................................................................................................................10
7.1 0402 Capacitors & Resistors..................................................................................................................................11
7.2 0603 Capacitors, Inductors & Resistors..................................................................................................................12
7.3 0805 Capacitors, Inductors & Resistors ………………………………………………………………………………… 12
7.3 Resistor Network....................................................................................................................................................13
7.4 Polarised Capacitors- specific to tantalum capacitors ............................................................................................14
7.5 Inductors.................................................................................................................................................................15
7.6 Inductors, Large .....................................................................................................................................................16
7.7 Inductors, Odd shape.............................................................................................................................................17
7.8 Thermistors ............................................................................................................................................................18
7.9 Transistors and Diodes ..........................................................................................................................................19
7.9.1 SOT23 and SOT323 Diodes/Transistors .........................................................................................................19
7.9.2 SOT89 Diodes/Transistors ..............................................................................................................................20
7.9.3 SC59 Diodes...................................................................................................................................................21
7.9.4 Case 403A-03 (SMB) Diodes ..........................................................................................................................22
7.9.5 Leaded Diodes................................................................................................................................................23
7.9.6 Transistors ......................................................................................................................................................24
7.9.7 Leaded TO220AB Transistor (Case221A) standing mount.............................................................................25
7.10 SOIC's, Small Outline Integrated Circuits ...............................................................................................................26
7.11 PLCC, Plastic Leadless Chip Carrier ......................................................................................................................27
7.12 CLCC Component – Ceramic Leadless Chip Carrier .............................................................................................28
7.13 BUMP TERMINATION...........................................................................................................................................29
7.13.1 Definition .........................................................................................................................................................29
7.13.2 Pad Diameter (Dimension D)...........................................................................................................................31
7.13.3 Pad Positioning ...............................................................................................................................................32
7.13.4 Solder Mask....................................................................................................................................................32
7.13.5 Solder Paste Aperture.....................................................................................................................................32
7.13.6 Conductor width between adjacent ‘Bumped Terminations’ and allowable via pad size within array.............32
8. FIRST GENERATION GUIDELINES FOR GENERATING PADSTACKS.....................................................................33
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Thanks，如果再详细一点就更好了

感谢楼主的精彩分享,希望有更多的资料贴出来,谢谢!

感谢楼主的精彩分享,希望有更多的资料贴出来,谢谢!