New Developments in PCB Laminates [复制链接]

With the ever accelerating demands in printed circuit board (PCB) design, the choices of advanced laminate materials have become fewer and fewer. The trends continue towards higher frequency requirements, exotic via structures, shrinking hole to hole pitch, multiple lamination
cycles, increased operating temperature, and more stringent environmental regulations for halogen-free and lead-free solder assembly! These constantly evolving new challenges for the PCB industry have made many of the tried and true materials obsolete. Demands for high speed
digital (HSD), high density interconnect (HDI), halogen free, lead-free processable materials are becoming more prevalent and the laminate technology supporting these demands is still in the early stages and in some cases does not yet exist............. PCB-Laminates-Developments.pdf (443 K) 下载次数:49

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