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附帶J-STD-001---006
Standard Organizations
The following documents on surface mount technology have been developed by U.S. and international standards organizations. The letter prefix of each document indicates the organization responsible for that document.
EIA -Electronic Industries Association
JEDEC -Joint Electron Devices Engineering Council of the EIA
IPC -Institute for Interconnecting and Packaging Electronic Circuits
MIL -Military
DoD -Department of Defense
J-STD -Joint Industry Standards
Components, General
EIA-886-E* Standard Test Methods for Passive Electronic Component Parts - General Instructions and Index
EIA-481-A Taping of Surface Mount Components for Automatic Placement
EIA-481-1 8mm and 12mm Taping of Surface Mount Components for Automatic Handling
EIA-481-2 16mm and 24mm Embossed Carrier Taping of Surface Mount Components for Automated Handling
EIA-481-3 32mm, 44mm, and 56mm Embossed Carrier Taping of Surface Mount Components for Automated Handling
EIA/IS-47 Contact Termination Finish Standard for Surface Mount Devices
EIA-PDP-100 Registered and Standard Mechanical Outlines for Electronic Parts
EIA-JEP-95 JEDEC Registered and Standard Mechanical Outlines for Semiconductor Devices
EIA-JESD30 Descriptive Designation System for Semiconductor Device Packages
EIA-JESD95-1 Design Requirements for Outlines of Solid-State and Related Products
IPC-3001 Component Qualification for the Assembly Process
IPC-SM-786 Recommended Procedure for Handling of Moisture Sensitive Plastic IC Packages
* This document is an umbrella document that consists of a series of uniform test methods for Electronic Component Parts.
Components, Passive Capacitors
EIA-198-D Ceramic Dielectric Capacitors Classes I, II, III, and IV
EIA-469-B Standard Test Method for Destructive Physical Analysis of High Reliability Ceramic Monolithic Capacitors
EIA-479 Film-Paper, Film Dielectric Capacitors for Microwave Ovens
EIA-510 Standard Test Method for Destructive Physical Analysis of Industrial Grade Ceramic Monolithic Capacitors
EIA-535 Series of Detail Specifications on Fixed Tantalum Capacitors that have been adopted by the National Electronic Components Quality (NECQ) Assessment System
EIA-CB-11 Guidelines for the Surface Mounting of Multilayer Ceramic Chip Capacitors
EIA/IS-28 Fixed Tantalum Chip Capacitor Style 1 Protected - Standard Capacitance Range
EIA/IS-29 Fixed Tantalum Chip Capacitor Style 1 Protected - Extended Capacitance Range
EIA/IS-35 Two-Pin Dual In-Line Capacitors
EIA/IS-36 Chip Capacitors, Multi-Layer (Ceramic Dielectric)
EIA/IS-37 Multiple Layer High Voltage Capacitors (Radial Lead Chip Capacitors)
EIA/IS-38 Radial Lead Capacitors (Conformally Coated)
EIA/IS-39 Ceramic Dielectric Axial Capacitors Glass Encapsulated)
IEC-384-3 Sectional Specification, Tantalum Chip Capacitors
IEC-384-10 Sectional Specification, Fixed Multilayer Ceramic Chip Capacitors
IECQ Draft Blank Detail Specification, Fixed Multilayer Ceramic Chip Capacitors
IECQ-PQC-31 Sectional Specification, Fixed Tantalum Chip Capacitors with Solid Electrolyte
IECQ-PQC-32 Blank Detail Specification, Fixed Tantalum Chip Capacitor
Resistors
EIA-575 Resistors, Rectangular, Surface Mount, General Purpose
EIA-576 Resistors, Rectangular, Surface Mount, Precision
EIA/IS-34 Leaded Surface Mount Resistor Networks Fixed Film
Components, Active
EIA-JEP-95 JEDEC Registered and Standard Outlines for Semiconductor Devices
EIA-JESD11 Chip Carrier Pinouts Standardized for CMOS 4000, HC, and HCT Series of Logic Circuits
EIA-JESD21-C Configurations for Solid State Memories
EIA-JESD22-B Test Methods and Procedures for Solid State Devices Used in Transportation/Automotive Applications Series format--consists of over 16 different test procedure documents.)
EIA-JESD-26A General Requirements, PEM, Rugged Environments
EIA-JESD30 Descriptive Designation System for Semiconductor Device Packages
EIA-JESD95-1 Design Requirements for Outlines of Solid-State and Related Products
Components, Electromechanical Connectors
EIA-429 Industry Standard for Connectors, Electrical Flat Cable Type (IPC-FC-218B)
EIA-364-B Electrical Connector Test Procedures Including Environmental Classifications (Series format consisting of over 60 Electrical Connector test procedures.)
EIA-506 Dimensional and Functional Characteristics Defining Sockets for Leadless Type A Chip Carriers (.050 Spacing)
EIA-507 Dimensional Characteristics Defining Edge Clips for Use with Hybrid and Chip Carriers
EIA/IS-47 Contact Termination Finish Standard for Surface Mount Devices
EIA/IS-64 Two Millimeter, Two-Part Connectors for Use with Printed Boards and Backplanes
Sockets
EIA-5400000 Generic Specification for Sockets for Integrated Circuit (IC) Packages for Use in Electronic Equipment (Series format with over 20 Sectional, Blank Detail & Detail Specifications, approved for use in the NECQ System.)
Switches
IECQ-PQC-41 Detail Specification, Dual-in-Line Switch, Surface
-US00003 Mountable, Slide Actuated
EIA-448-23 Surface Mountable Switches, Qualification Test
EIA-5200000-A Generic Specification for Special-Use Electromechanical Switches of Certified Quality (Series format with over 25 Sectional, Blank Detail & Detail Specifications, approved for use in the NECQ System.)
Printed Boards
IPC-FC-250 Performance Specification for Single and Double-sided Flexible Printed Boards
IPC-RF-245 Performance Specification for Rigid-Flex Multilayer Printed Boards
IPC-RB-276 Performance Specification for Rigid Printed Boards
IPC-MC-324 Performance Specification for Metal Core Boards
IPC-HM-860 Performance Specification for Hybrid Multilayer
IPC-6301 Performance Specification for Organic Multichip Module Structures (MCM-L)
MIL-P-50884 Military Specification Printed Wiring, Flexible, and Rigid Flex
MIL-P-55110 Military Specification Printed Wiring Boards, General Specification For
IPC-DW-425/424 Discrete Wiring Technology
MIL-P-RRRRR Printed Circuit Board/Printed Wiring Board Manufacturing, General Specification For
Materials
IPC-L-108B Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards
IPC-L-109B Specification for Resin Preimpregnated Fabric (Prepreg) for Multilayer Printed Boards
IPC-CC-110 Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications
IPC-L-115B Specification for Rigid Metal Clad Base Materials for Printed Boards
IPC-CF-148 Resin Coated Metal for Multilayer Printed Boards
IPC-MF-150F Metal Foil for Printed Wiring Applications
IPC-CF-152 Metallic Foil Specification for Copper/Invar/Copper (CIC) for Printed Wiring and Other Related Applications
IPC-SM-817 General Requirements for SMT Adhesives
IPC-CC-830 Qualification and Performance of Electrical Insulation Compounds for Printed Board Assemblies
IPC-SM-840 Qualification and Performance of Permanent Polymer Coating (Solder Mask) for Printed Boards
J-STD-004 Requirements for Soldering Fluxes
J-STD-005 General Requirements and Test Methods for Electronic Grade Solder Paste
J-STD-006 General Requirements and Test Methods for Soft Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
Design Activities
IPC-D-249 Design Standard for Flexible Single and Double-sided Printed Boards
IPC-D-275 Design Standard for Rigid Printed Boards and Rigid Printed Board Assemblies
IPC-D-279 Reliability Design Guidelines for Surface Mount Technology Printed Board Assemblies
IPC-D-317 Design Standard for Electronic Packaging Utilizing High Speed Techniques
IPC-C-406 Design and Application Guidelines for Surface Mount Connectors
IPC-SM-782 Surface Mount Land Patterns (Configuration and Design Rules)
IPC-H-855 Hybrid Microcircuit Design Guide
IPC-D-859 Design Standard for Multilayer Hybrid Circuits
IPC-2301 Design Standard for Organic Multichip Modules(MCM-L) and MCM-L Assemblies
MIL-STD-2118 Design Standard for Flexible Printed Wiring
Component Mounting
EIA-CB-11 Guidelines for the Surface Mounting of Multilayer Ceramic Chip Capacitors
IPC-CM-770 Guidelines for Printed Board Component Mounting
IPC-SM-784 Guidelines for Direct Chip Attachment
SMC-TR-001 An Introduction to Tape Automated Bonding and Fine Pitch Technology
IPC-SM-780 Electronic Component Packaging and Interconnection with Emphasis on Surface Mounting
J-STD-012 Implementation of Flip Chip and Scale Chip Technology
J-STD-013 Implementation of Ball Grid Array and other High Density Technology
Soldering and Solderability
EIA/IS-46 Test Procedure for Resistance to Soldering (Vapor Phase Technique) for Surface Mount Devices
EIA/IS-49-A Solderability Test Method for Leads and Terminations
EIA-448-19 Method 19 Test Standard for Electromechanical Components Environmental Effects of Machine Soldering Using a Vapor Phase System
IPC-TR-460A Trouble Shooting Checklist for Wave Soldering Printed Wiring Boards
IPC-TR-462 Solderability Evaluation of Printed Boards with Protective Coatings Over Long-term Storage
IPC-TR-464 Accelerated Aging for Solderability Evaluations
J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies
J-STD-002 Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
J-STD-003 Solderability Tests of Printed Boards
IPC-S-816 Troubleshooting for Surface Mount Soldering
IPC-AJ-820 Assembly and Joining Handbook
Quality Assessment
EIA-469-B Standard Test Method for Destructive Physical Analysis of High Reliability Ceramic Monolithic Capacitors
EIA-510 Standard Test Method for Destructive Physical Analysis of Industrial Grade Ceramic Monolithic Capacitors
IPC-A-600 Acceptability of Printed Boards
IPC-A-610 Acceptability of Printed Board Assemblies
MIL-STD-883 Methods and Procedures for Microelectronics
IPC-TR-551 Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components Reliability
IPC-A-24 Flux/Board Interaction Board
IPC-A-36 Cleaning Alternatives Artwork
IPC-A-38 Fine Line Round Robin Test Pattern
IPC-A-48 Surface Mount Artwork
IPC-AI-640 User Requirements for Automatic Inspection of Unpopulated Thick Film Hybrid Substrates
IPC-AI-641 User Guidelines for Automated Solder Joint Inspection Systems
IPC-AI-642 User Guidelines for Automated Inspection of Artwork and Innerlayers
IPC-AI-643 User Guidelines for Automatic Optical Inspection of Populated Packaging and Interconnection
Surface Mount Process
IPC-SC-60 Post Solder Solvent Cleaning Handbook
IPC-SA-61 Post Solder Semi Aqueous Cleaning Handbook
IPC-AC-62 Post Solder Aqueous Cleaning Handbook
IPC-TR-580 Cleaning and Cleanliness Test Program Phase 1 Test Results
IPC-SM-785 Guidelines for Accelerated Surface Mount Attachment Reliability Testing
Numerical Control Standards
IPC-NC-349 Computer Numerical Formatting for Drilling and Routing Equipment
IPC-D-350D Printed Board Description in Digital Form - }
IEC-1182-1 Printed Board Description in Digital Form - } Companion Documents
IPC-D-351 Printed Wiring Documentation in Digital Form
IPC-D-352 Electronic Design Database Description for Printed Boards
IPC-D-354 Library Format Description for Printed Boards in Digital Form
IPC-D-356 Bare Board Electrical Test Information in Digital Form
EIA-224-B Character Code for Numerical Machine Control Perforated Tape
EIA-227-A One-Inch Perforated Tape
EIA-267-B Axis and Motion Nomenclature for Numerically Controlled Machines
EIA-274-D Interchangeable Variable Block Data Format for Positioning, Contouring, and Contouring/Positioning Numerically Controlled Machines
EIA-281-B Electrical and Construction Standards for Numerical Machine Control
EIA-358-B Subset of American National Standard Code for Information Interchange for Numerical Machine Control Perforated Tape
EIA-408 Interface Between Numerical Control Equipment on Data Terminal Equipment Employing Parallel Binary Data Interchange
EIA-431 Electrical Interface Between Numerical Control and Machine Tools
EIA-441 Operator Interface Function of Numerical Controls
EIA-474 Flexible Disk Format for Numerical Control Equipment Information Interchange
EIA-484 Electrical and Mechanical Interface Characteristics and Line Control Protocol Using Communication Control Characters for Serial Data Link Between a Direct Numerical Control System and Numerical Control Equipment Employing Asynchronous Full Duplex Transmission
EIA-494 32 BIT Binary CL Exchange (BCL) Input Format for Numerically Controlled Machines
Test Methods
EIA-JEDEC Method B 105-A, Lead Integrity - Plastic Leaded Chip Carrier (PLCC) Packages
EIA-JEDEC Method B 102, Surface Mount Solderability Test(JESD22-B)
EIA-JEDEC Method B 108, Coplanarity (intended for inclusion into JESD 22-C)
IPC-TM-650 Test Methods Manual
Repair
IPC-R-700C Guidelines for Repair and Modification of Printed Board Assemblies
Terms and Definitions
IPC-T-50E Terms and Definitions for Interconnecting and Packaging Electronic Circuits
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