[求助] 请教COF [复制链接]

请问哪位楼主有COF的资料，能否与小弟共享？谢谢！:confused: :rolleyes: :em28

转载：
COF為一種晶粒軟模模組技術，利用COG技術製程的特點，將軟模具有
承載IC及被動元件的能力，?K且在可撓取曲的方面，COF除有注於提升
產品功能化、高

请教COF是哪三个英文的缩写及中文意思是什么？谢谢！:em33

COG模組為一種將晶粒與玻璃結合之精密

[QUOTE]最初由 y-jiang 发表
[B]请教COF是哪三个英文的缩写及中文意思是什么？谢谢！:em33 [/B][/QUOTE]

COF=Chip On Film,
即芯片被直接安装在柔性PCB上。这种连接方式的集成度较高，外围元件可以与IC一起安装在柔性PCB上，这是一种新兴技术，目前已进入试生产阶段。

COG=Chip On Glass。
即芯片被直接邦定在玻璃上。这种安装方式可大大减小整个LCD模块的体积，且易于大批量生产，适用于消费类电子产品用的LCD，如：手机、PDA等便携式电子产品。这种安装方式在IC生产商的推动下，将会是今后IC与LCD的主要连接方式。

请问会有COG代替COB的那一天吗？

我觉得会有那一天，要看消费电子的市场来决定了。

^高興

好東東﹗又長見識了﹗

^加油

多谢各位当家的指导。

COG在便携产品中用得很多，因为它的小尺寸。
我个人认为COG比COF要可靠。

Hi all

want to know more visit the following wed page
http://www.telephus.com/html/products/acf.htm

本文主要说明COF在产业发展中的现状，文中将举例各种尺寸的平面显示器产业及生产状况。

:)
We developed a so-called "reel-to-reel method" COF technology using a long carrier tape for the LCD driver
package. This method enables mass production of COF. We used the ILB (inner lead bonding) technique that
connects inner leads on a 2-layered tape (glue-less) to Au bumps on an IC chip. COP tape material should be
carefully selected with respect to both thermal expansion and heat resistance, because the IC chips are
connected to the tape at a temperature over 400 C. In cooperation with a resin maker, we developed the
underfill material, which enables filling the narrow spaces between the IC chip and the 2-layered chip
without bubbles. The 2-layered tape also features easy installation onto CR parts and is flexible enough to
bend freely. These features offer a promising advantage when this method is applied to compact appliances
such as cellular phones and PDAs.