(1)Rising/Falling Slope :1~3℃/sec
(2)soaking time (150℃-200℃):60-120sec(except pcb and component Body)
(3)profile over 220℃ time25-60sec(except pcb and component Body)
(4)Time 25℃ to peak temperature: 8minutes max
5-1.PCB<245℃
5-2.BGA/PGA Center Ball:230-245℃
5-3.Other:230-245℃
仅供参考,每个客户要求不一样,产品不一样,设备也不一样,用的锡膏也不一样。