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zzhzhang 2007-11-06 07:40
Solderability of Lead-free Surface Finishes After Lead Free IR Reflow Process.
FYI.
来源于HKPCA网站。

samnet1 2007-11-06 11:01

Thanks for your article and it seems to be a rather technical information.

This article by means of SEM & EDX to investigate the wetting balance test results of four lead-free surface finishes –
Electroless nickel immersion gold (ENIG),
Immersion Silver (ImAg),
Immersion Tin(ImSn),
and Organic Solderability Preservative (OSP)

after through lead-free IR reflow process.


查看完整版本: [-- Solderability of LF Surface After LF IR Reflow Process --] [-- top --]


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