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yuxingling

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  • 男,2005-05-31 21:18
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最后登录:2009-08-03 10:33

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Iphone projct introduction

2008-07-02 - 回复:1,人气:2684 - SMT工艺

A proper heat dissipation technique should be executed and dissipation can be accelerated by various
ACF training data

2008-06-03 - 回复:5,人气:4917 - SMT工艺

ACF is a thermoplastic (some with Epoxy) adhesive matrix randomly loaded with conductive particles.
Solder flux compatible with flip-chip underfill material

2008-04-01 - 回复:0,人气:3894 - RoHS-绿色制程

Description FIELD OF THE INVENTION The invention relates generally to interconnection and encaps
SMT PROCESS GUIDELINE AND CHECK LIST

2008-03-05 - 回复:2,人气:4140 - SMT工艺

SCOPE This document is intended to provide guidelines and assistance in performing and troubleshooti
underfill 胶水不固化

2008-03-04 - 回复:13,人气:10099 - SMT工艺

  在公司的NPI 过程中,时常会遇到胶水不固化的现象,不固化的地方为BGA 中间一小部分,检查profile b

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