Intel IC SMT 完全手册: 封装,制造过程,ESD,MSL,BGA (共15章)|SMT相关资料下载 - SMT之家论坛

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看起来是个个很详细的资料，好东西，看看，

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Re:Intel IC SMT 完全手册: 封装,制造过程,ESD,MSL,BGA (共15 ..

0402 = ??

PLCC= ???

QFP =??

You can find it from the following article
Info from :http://en.wikipedia.org/wiki/Surface-mount_technology:

Package sizes

Surface-mount components are usually smaller than their counterparts with leads, and are designed to be handled by machines rather than by humans. The electronics industry has standardized package shapes and sizes (the leading standardisation body is JEDEC). These include:

Two-terminal packages

Rectangular passive components (mostly resistors and capacitors):
01005: 0.016" × 0.008" (0.4 mm × 0.2 mm)
0201: 0.024" × 0.012" (0.6 mm × 0.3 mm)
0402 (1005): 0.04" × 0.02" (1.0 mm × 0.5 mm)
0603 (1608): 0.063" × 0.031" (1.6 mm × 0.8 mm)
0805 (2012): 0.08" × 0.05" (2.0 mm × 1.25 mm)
1206 (3216): 0.126" × 0.063" (3.2 mm × 1.6 mm)
1806 (4516): 0.177" × 0.063" (4.5 mm × 1.6 mm)
1812 (4532): 0.18" × 0.12" (4.6 mm × 3.0 mm)
1825: 0.25" × 0.177" (6.35 mm × 4.5 mm)
2512: 0.25" × 0.12" (6.35 mm × 3.0 mm)

Tantalum capacitors [1]:

Size A (EIA 3216-18): 3.2 mm × 1.6 mm × 1.6 mm
Size B (EIA 3528-21): 3.5 mm × 2.8 mm × 1.9 mm
Size C (EIA 6032-28): 6.0 mm × 3.2 mm × 2.2 mm
Size D (EIA 7343-31): 7.3 mm × 4.3 mm × 2.4 mm
Size E (EIA 7343-43): 7.3 mm × 4.3 mm × 4.1 mm
SOD: Small Outline Diode
SOD-323: 1.7 × 1.25 × 0.95 mm
SOD-123: 3.68 × 1.17 × 1.60 mm
SOD-80C: 3.50mm × 1.50mm × More info [2]

MELF — Metal Electrode Leadless Face — (mostly resistors and diodes): Barrel shaped components, dimensions do not match those of rectangular references for identical codes.
Size 0201: L:2.2mm D:1.1mm (solder pad fits rectangular 0805)
Size 0204: L:3.6mm D:1.4mm (solder pad fits rectangular 1206)
Size 0207: L:5.8mm D:2.2mm

Three-terminal packages

SOT: small-outline transistor, with three terminals [3]
SOT-23: 3 mm × 1.75 mm × 1.3 mm body - three terminals for a transistor, or up to eight terminals for an integrated circuit
SOT-223: 6.7 mm × 3.7 mm × 1.8 mm body - four terminals, one of which is a large heat-transfer pad
DPAK (TO-252): discrete packaging. Developed by Motorola to house higher powered devices. Comes in three- or five-terminal versions [4]
D2PAK (TO-263) - bigger than the DPAK; basically a surface mount equivalent of the TO220 through-hole package. Comes in 3, 5, 6, 7, 8 or 9-terminal versions [5]
D3PAK (TO-268) - even larger than D2PAK [6]
Packages with four or more terminals (drawings of most of the following packages can be found on [7])

Dual-in-line

Small-Outline Integrated Circuit (SOIC) - small-outline integrated circuit, dual-in-line, 8 or more pins, gull-wing lead form, pin spacing 1.27 mm
J-Leaded Small Outline Package (SOJ) - the same as SOIC except J-leaded [8]
TSOP - thin small-outline package, thinner than SOIC with smaller pin spacing of 0.5 mm
SSOP - shrink small-outline package, pin spacing of 0.635 mm or in some cases 0.8mm
TSSOP - thin shrink small-outline package.
QSOP - quarter-size small-outline package, with pin spacing of 0.635 mm
VSOP - even smaller than QSOP; 0.4, 0.5 mm or 0.65 mm pin spacing
Quad-in-line
PLCC - plastic leaded chip carrier, square, J-lead, pin spacing 1.27 mm
QFP - Quad Flat Package, various sizes, with pins on all four sides
LQFP - Low-profile Quad Flat Package, 1.4 mm high, varying sized and pins on all four sides
PQFP - plastic quad flat-pack, a square with pins on all four sides, 44 or more pins
CQFP - ceramic quad flat-pack, similar to PQFP
MQFP - Metric Quad Flat Pack, a QFP package with metric pin distribution
TQFP - thin quad flat pack, a thinner version of PQFP
QFN - quad flat pack, no-leads, smaller footprint than leaded equivalent
LCC - Leadless Chip Carrier, contacts are recesses vertically to "whick-in" solder. Common in aviation electronics because of mechanical endurance against vibration.
MLP - Leadframe package with a 0.5 mm contact pitch, no leads [9]
PQFN - power quad flat-pack, no-leads, with exposed die-pad[s] for heatsinking
Grid arrays
PGA - Pin grid array.
BGA - ball grid array, with a square or rectangular array of solder balls on one surface, ball spacing typically 1.27 mm
LFBGA - low profile fine pitch ball grid array, with a square or rectangular array of solder balls on one surface, ball spacing typically 0.8 mm
CGA - column grid array, circuit package in which the input and output points are high temperature solder cylinders or columns arranged in a grid pattern.
CCGA - ceramic column grid array, circuit package in which the input and output points are high temperature solder cylinders or columns arranged in a grid pattern. The body of the component is ceramic.
μBGA - micro-BGA, with ball spacing less than 1 mm
LLP - Lead Less Package, a package with metric pin distribution (0.5 mm pitch).
Non-packaged devices (although surface mount, these devices require specific process for assembly):
COB - chip-on-board; a bare silicon chip, that is usually an integrated circuit, is supplied without a package (usually a lead frame overmolded with epoxy) and is attached, often with epoxy, directly to a circuit board. The chip is then wire bonded and protected from mechanical damage and contamination by an epoxy "glob-top".
COF - chip-on-flex; a variation of COB, where a chip is mounted directly to a flex circuit.
COG - chip-on-glass; a variation of COB, where a chip is mounted directly to a piece of glass - typically an LCD display.
There are often subtle variations in package details from manufacturer to manufacturer, and even though standard designations are used, designers need to confirm dimensions when laying out printed circuit boards.

[ 此贴被samnet1在2008-01-19 10:52重新编辑 ]