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中英对照学 英文: 如何重建崩解中的内存产业? [复制链接]

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只看楼主 倒序阅读 使用道具 楼主  发表于: 2009-06-30
如何重建崩解中的内存产业?

内存产业的经营模式面临崩解,产业观察家认为,解决之道是更理性的行为以及整并。以上是一场于美国举行的、探讨内存技术与市场趋势的Memcon研讨会上,某业界高层所发表的看法。
持续低迷的内存产业景气让所有的供货商荷包大失血,他们之中有不少都面临巨额亏损;而且奇梦达(Qimonda)与Spansion已经分别声请破产。谁会是下一个?产业观察家现在怀疑台湾的众家DRAM制造商可能撑不下去,甚至认为就连Elpida、Hynix与Micron等大厂也命在旦夕。

不过也有人预期,内存产业将在09年第四季或2010年第一季复苏;其它人则不能确定,因为市场需求与内存平均销售价格(ASP)仍然疲软。

「内存产业经营模式已经崩解;」一家新创非挥发性内存供货商Unity Semiconductor董事长、总裁暨执行长Darrell Rinerson表示,供货商们正在为生存而相互斗争,而谁将能成为产业复苏的最后幸存者,将取决于供货商的心态。

内存产业的低迷时期已经持续多年,该市场衰退的原因包括需求不振、价格疲软以及供应过剩。眼前的萧条情况没什么特殊之处,需求水准仍然低落,而且最近刚有过一波无节制的、不理性的产能扩充潮发生,尤其是在台湾。

但Rinerson认为,这一次内存产业衰退在某些方面又与过去的景气循环时期有所不同。在过去,景气大好时能让供货商赚到不少现金,可直接用于新资本设备的添购或产品的创新,而现在,荣景虽能带来现金,作为资本支出却嫌太少:「供货商没有足够的现金来实现创新。」

对Rinerson来说,产业前景是黯淡无光的,没有征兆显示内存产业模式能够被修复,尤其多数内存业者都负债累累,不再是创新者;当内存供货商们无法逃出严重的负债循环,内存产业模式也就会持续往下堕落。

半导体分析师鼓吹内存制造商整并已有好一段时间,他们已经将政府金援策略搁在一边,认为只有整并才能使内存产业恢复获利与健全;分析师并指出,内存供货商必须在产能扩充与产品定价上采取更理性的态度。

这些呼吁大多数是直指台湾的内存供货商,但当地的DRAM厂已对整并表示抗拒。

幸 好内存产业还有一线生机──据Rinerson表示,新一代内存技术已经迈入成熟阶段,特别是服务器等系统应用的储存级内存(storage- class memories);所谓的储存级内存,号称是可作为处理器与系统磁盘之间I/O间距(gap)之桥梁的新一代组件。

储 存级内存包括部份(非全部)所谓的通用内存(universal memory'),例如FRAM、MRAM、相变化(phase-change)、RRAM等新技术;不过这些新一代技术大部份距离实现还有数年,有人甚 至怀疑这些新技术是否能真的脱离原型阶段进入量产。

因此产业顾问公司JLC Associates总裁Jim Cantore认为,大多数的新内存技术恐怕暂时难以摆脱窘境,而现有的内存技术如DRAM、NAND与NOR,将继续扩张它们的市场版图并开创新应用。

新一代内存技术的开发者还在积极开发产品,他们也有很好的理由──市场研究机构Web-Feet Research执行长Alan Niebel估计,储存级内存市场将在09年由0达到5,000万美元,甚至在2015年扩张到60亿美元。

在 该领域也有不少厂商,Unity Semiconductor就是其中之一,该公司的CMOx技术是以一种称为导电金属氧化物(conductive metal oxides)的新材料为基础,据说能导致离子运动;利用该技术,Unity Semiconductor开发出一种被动式可重复读写交叉点内存数组(passive rewritable crosspoint memory array),号称在内存单元内不需要晶体管。

另外还有一家新创公司Qs Semiconductor不久前神秘兮兮地出现,说他们正在开发一种以碳硅
(carbon-silicon)或碳化硅(silicon carbide,SiC)材料为基础的、采用硅基板的非挥发性内存。
另两家内存大厂Numonyx与Samsung Electronics,不久前也宣布将连手开发相变化内存技术,预计今年可订出共同规格,并在2010年推出产品。

新 组件也需要新的标准;Numonyx表示,以JEDEC 42.6为基础的LPDDR2接口将成为新一代1Gbit、45nm制程内存的标准,目标应用于手机、嵌入式内存与高阶运算装置。手机大厂Nokia 也支持该标准;据了解,该公司计划在手机内使用相变化内存技术,这也是促使Numonyx与Samsung策略联盟的主因。

至于传统内存技术的前景,状况则有些复杂;分析师表示,包括ARM、Denali、Synopsys、Virage等内存接口IP供货商的业绩,目前已看到好转。NOR/NAND闪存市场预计在09年达到185亿美元规模,较08年衰退9.5%。

Web-Feet的Niebel预期,整体内存产业的衰退情况将在今年第四季或明年第一季终止,内存价格已经趋于稳定,多个应用领域也开始看到微幅需求成长。JLC的Cantore补充指出:「NAND市场的恢复速度会比DRAM市场来得快。」

在DRAM市场部份,Lazard Capital Markets分析师Daniel Amir表示,DRAM价格平稳,若状况持续,DRAM厂商可能会开始提升产能;目前整体DRAM库存水位也在低点。
(参考原文: Exec: Memory business model is broken,by Mark LaPedus)

http://www.eettaiwan.com/ART_8800576900_628626_NT_a47887ed.HTM?click_from=8800026964,8655279197,2009-06-29,EETOL,ARTICLE_ALERT
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只看该作者 沙发  发表于: 2009-06-30
Exec: Memory business model is broken

EE Times
(06/25/2009 7:51 H EDT)

SANTA CLARA, Calif. -- The business model in the memory sector is broken, prompting the need for more rational behavior and consolidation in the industry, according to an executive at the Memcon technology event here.

The current and horrific memory downturn continues to take a toll on vendors, many of which are losing vast sums of money. And two companies--Qimonda AG and Spansion Inc.--have separately filed for protection under bankruptcy.

What's next? Observers wonder if Taiwan's DRAM makers will go under. Even the bigger players--Elpida, Hynix and Micron--are on the ropes.

Some are expecting a recovery in the memory sector by the fourth quarter of 2009 or first quarter of 2010. Others are not so sure, as demand and average selling prices (ASPs) remains soft.

''The memory business model is broken,'' said Darrell Rinerson, chairman, president and CEO of Unity Semiconductor Corp., a next-generation memory hopeful.

The shattered model is having an ominous impact in the supply chain. Many ''vendors are fighting for survival,'' Rinerson said in an interview at Memcon. ''It is coming down to the mentality (of which memory vendor) will be the last man standing'' if or when the down cycle is over.

For years, the memory business has seen its share of bad cycles. Memory downturns are caused by lackluster demand, soft prices and oversupply.

The current downturn is no different in that respect. Demand has been weak. And in recent times, there was a wave of unrestrained and irrational capacity build-up, especially in Taiwan.

But the current memory downturn is somewhat different than past cycles, Rinerson contended. In the past, the boom cycles enabled vendors to generate an abundance of cash, which would be directed towards new capital and innovative products.

Now, the boom times generate cash, but ''not enough for pay for capital (expenditures),'' he said. ''Vendors don't have enough cash to innovate.''

The outlook, according to the Unity executive, is gloomy. There is no sign that the memory business model can be fixed, as many vendors have fast become debt machines instead of true innovators. Vendors can't escape the vicious debt cycle and the memory business model continues on a ''downward spiral,'' he said.

For some time, semiconductor analysts have urged memory makers to consolidate--and forget about the proposed bailouts--in an effort to restore profitability and sanity in the sector. Vendors must also take a more rational approach to scaling and product pricing, analysts said.

Most of the calls have been directed at Taiwan, but the island's DRAM have refused to consolidate.

Glimmer of hope
There is light at the end of the tunnel. The timing is ripe for new technologies in the sector, particularly for storage-class memories in servers and other systems, he said. Storage-class memories are next-generation devices that bridge the I/O gap between the processor and a disk drive in a system.

Storage-class memories includes some (but not all) of the so-called ''universal memory'' types, such as FRAM, MRAM, phase-change, RRAM and other newfangled technologies. As before, most--if not all--next-generation memory types are still years' away from becoming a reality. Some wonder if any of the new technologies will ever go beyond the prototype stage and will actually ship in volumes.

Most will get pushed out over time, as the incumbent technologies--DRAM, NAND and NOR--continue to scale and find new applications, said Jim Cantore, president of consulting firm JLC Associates.

Developers of the newfangled technologies are still scrambling to devise their parts--and for good reason. The storage-class memory sector is expected to grow from zero and hit $50 million in 2009, said Alan Niebel, chief executive of Web-Feet Research. By 2015, the storage-class memory sector could hit $6 billion, he said.

There are several players in the arena. More recently, Unity Semiconductor unveiled its nonvolatile memory technology. The company's technology, called CMOx, is based on the use of new materials called conductive metal oxides that are said to enable ionic motion. With the technology, Unity claims to have devised a passive rewritable crosspoint memory array that requires no transistors in a memory cell.

Another startup, called Qs Semiconductor Corp., came out of stealth mode on Wednesday (June 24) and said that it is developing a nonvolatile memory, based a carbon-silicon or silicon carbide (SiC) on silicon substrate technology.

Nonvolatile memory supplier Numonyx BV and memory chip giant Samsung Electronics Co. Ltd. this week announced that they will develop package specifications for phase-change memory products together. Common specifications between the two companies will be completed this year, with both companies expecting to have compliant devices available in 2010.

Future parts are aimed for a new standard. The upcoming standard, based on the JEDEC 42.6 interface definition is set to be an implementation of an LPDDR2 interface. The standard is set to be applied to a next-generation memory at 1-Gbit implemented in 45-nm process that is being aimed at mobile phone, embedded systems and high-end computing devices, Numonyx said.

Cell-phone giant Nokia is pushing the standard, sources said. Nokia wants phase-change in a mobile device. It is pushing Numonyx to find a second source, prompting them to forge a deal with rival Samsung, sources said.

he outlook?
The outlook for traditional memory is mixed. ARM, Denali, Synopsys, Virage and other memory interface IP vendors are now seeing an upswing in business, analysts said. The severe downturn is causing a growing number of OEMs to evaluate or rationalize their internal IP efforts, said Mark Gogolewski, chief technology officer of IP provider Denali Software Inc.

The flash memory market, including NOR and NAND, is expected to hit $18.5 billion in 2009, down 9.5 percent over 2008, Web-Feet's Niebel said.

The overall memory recession is expected to cease by the fourth quarter of this year or first quarter of next year, he said. Prices for memories are firming, while the market is beginning to see ''modest demand in multiple markets,'' he said during a presentation.

''NAND is on its way to recover faster than the DRAM market,'' added JLC's Cantore.

There are mixed signals in the market right now. NAND flash prices are expected to decline in the summer. ''Our sources in Taiwan reconfirm our thoughts that NAND chip prices will see a modest price decline in July/August of 10-to-15 prices,'' said Daniel Amir, an analyst at Lazard Capital Markets.

Some vendors are struggling in the arena. ''Toshiba faces issues with 3-bit-per-cell,'' Amir said. ''We have learned that, due to poor quality issues for 3-bit controllers made by Phison and others, Toshiba is unable to sell much of its 3-bit NAND production. While we believe this is temporary, we doubt that Toshiba is likely to aggressively increase NAND production, as previously expected, until this issue is resolved.''

What about DRAM? ''DRAM prices seem flat for July,'' he said. ''In our meetings with DRAM suppliers, we have learned that companies expect pricing to be flat in July and still see a $1.40-$1.50 range for 1-Gb pieces in the 2H of the year, which is above cash cost for many DRAM players. We believe that if prices remain in the $1.40-$1.50 range, we could see DRAM companies increase their capacity.''

DRAM inventories are also low. ''Our sources suggest that overall DRAM inventory remains fairly low at 2-4 weeks despite the lower demand in the summer period. The PC channel remains fairly healthy. DRAM inventory at module houses is higher (four weeks) mainly due to their expectation that DRAM will not move down in the near term,'' he added.


http://www.eetimes.com/showArticle.jhtml?articleID=218101455
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只看该作者 藤椅  发表于: 2009-06-30
如何重建崩解中的記憶體產業?

記憶體產業的經營模式面臨崩解,產業觀察家認為,解決之道是更理性的行為以及整並。以上是一場於美國舉行的、探討記憶體技術與市場趨勢的Memcon研討會上,某業界高層所發表的看法。
持續低迷的記憶體產業景氣讓所有的供應商荷包大失血,他們之中有不少都面臨巨額虧損;而且奇夢達(Qimonda)與Spansion已經分別聲請破產。誰會是下一個?產業觀察家現在懷疑臺灣的眾家DRAM製造商可能撐不下去,甚至認為就連Elpida、Hynix與Micron等大廠也命在旦夕。

不過也有人預期,記憶體產業將在09年第四季或2010年第一季復蘇;其他人則不能確定,因為市場需求與記憶體平均銷售價格(ASP)仍然疲軟。

「記憶體產業經營模式已經崩解;」一家新創非揮發性記憶體供應商Unity Semiconductor董事長、總裁暨執行長Darrell Rinerson表示,供應商們正在為生存而相互鬥爭,而誰將能成為產業復蘇的最後倖存者,將取決於供應商的心態。

記憶體產業的低迷時期已經持續多年,該市場衰退的原因包括需求不振、價格疲軟以及供應過剩。眼前的蕭條情況沒什麼特殊之處,需求水準仍然低落,而且最近剛有過一波無節制的、不理性的產能擴充潮發生,尤其是在臺灣。

但Rinerson認為,這一次記憶體產業衰退在某些方面又與過去的景氣迴圈時期有所不同。在過去,景氣大好時能讓供應商賺到不少現金,可直接用於新資本設備的添購或產品的創新,而現在,榮景雖能帶來現金,作為資本支出卻嫌太少:「供應商沒有足夠的現金來實現創新。」

對Rinerson來說,產業前景是黯淡無光的,沒有徵兆顯示記憶體產業模式能夠被修復,尤其多數記憶體業者都負債累累,不再是創新者;當記憶體供應商們無法逃出嚴重的負債迴圈,記憶體產業模式也就會持續往下墮落。

半導體分析師鼓吹記憶體製造商整並已有好一段時間,他們已經將政府金援策略擱在一邊,認為只有整並才能使記憶體產業恢復獲利與健全;分析師並指出,記憶體供應商必須在產能擴充與產品定價上採取更理性的態度。

這些呼籲大多數是直指臺灣的記憶體供應商,但當地的DRAM廠已對整並表示抗拒。

幸 好記憶體產業還有一線生機──據Rinerson表示,新一代記憶體技術已經邁入成熟階段,特別是伺服器等系統應用的儲存級記憶體(storage- class memories);所謂的儲存級記憶體,號稱是可作為處理器與系統磁片之間I/O間距(gap)之橋樑的新一代組件。

儲 存級記憶體包括部份(非全部)所謂的通用記憶體(universal memory'),例如FRAM、MRAM、相變化(phase-change)、RRAM等新技術;不過這些新一代技術大部份距離實現還有數年,有人甚 至懷疑這些新技術是否能真的脫離原型階段進入量產。

因此產業顧問公司JLC Associates總裁Jim Cantore認為,大多數的新記憶體技術恐怕暫時難以擺脫窘境,而現有的記憶體技術如DRAM、NAND與NOR,將繼續擴張它們的市場版圖並開創新應用。

新一代記憶體技術的開發者還在積極開發產品,他們也有很好的理由──市場研究機構Web-Feet Research執行長Alan Niebel估計,儲存級記憶體市場將在09年由0達到5,000萬美元,甚至在2015年擴張到60億美元。

在 該領域也有不少廠商,Unity Semiconductor就是其中之一,該公司的CMOx技術是以一種稱為導電金屬氧化物(conductive metal oxides)的新材料為基礎,據說能導致離子運動;利用該技術,Unity Semiconductor開發出一種被動式可重複讀寫交叉點記憶體陣列(passive rewritable crosspoint memory array),號稱在記憶體單元內不需要電晶體。

另外還有一家新創公司Qs Semiconductor不久前神秘兮兮地出現,說他們正在開發一種以碳矽
(carbon-silicon)或碳化矽(silicon carbide,SiC)材料為基礎的、採用矽基板的非揮發性記憶體。
另兩家記憶體大廠Numonyx與Samsung Electronics,不久前也宣佈將聯手開發相變化記憶體技術,預計今年可訂出共同規格,並在2010年推出產品。

新 元件也需要新的標準;Numonyx表示,以JEDEC 42.6為基礎的LPDDR2介面將成為新一代1Gbit、45nm制程記憶體的標準,目標應用於手機、嵌入式記憶體與高階運算裝置。手機大廠Nokia 也支援該標準;據瞭解,該公司計畫在手機內使用相變化記憶體技術,這也是促使Numonyx與Samsung策略聯盟的主因。

至於傳統記憶體技術的前景,狀況則有些複雜;分析師表示,包括ARM、Denali、Synopsys、Virage等記憶體介面IP供應商的業績,目前已看到好轉。NOR/NAND快閃記憶體市場預計在09年達到185億美元規模,較08年衰退9.5%。

Web-Feet的Niebel預期,整體記憶體產業的衰退情況將在今年第四季或明年第一季終止,記憶體價格已經趨於穩定,多個應用領域也開始看到微幅需求成長。JLC的Cantore補充指出:「NAND市場的恢復速度會比DRAM市場來得快。」

在DRAM市場部份,Lazard Capital Markets分析師Daniel Amir表示,DRAM價格平穩,若狀況持續,DRAM廠商可能會開始提升產能;目前整體DRAM庫存水位也在低點。
(參考原文: Exec: Memory business model is broken,by Mark LaPedus)



http://www.eettaiwan.com/ART_8800576900_628626_NT_a47887ed.HTM?click_from=8800026964,8655279197,2009-06-29,EETOL,ARTICLE_ALERT