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Customer Audit check list [复制链接]

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离线samuel_gao
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只看楼主 倒序阅读 使用道具 楼主  发表于: 2009-09-05
Following are the respective section audit items, pls dedicated ownership well prepare the highlighted points and ensure good 5S all the time

1.       For Group 1 – Auditee lead by 111
a)       Shop floor respective area 5S & discipline awareness and execution – owner:
                i.         Man (wearing and awareness on antistatic control & operation alert)
              ii.         Work station and it surrounding area clear identification (LF, Leaded, operator ID…)
              iii.         Machine, work bench and floor cleanness
              iv.         Visualize management (WI, procedure, recording sheet, PM label, notice board…)
                v.         Part storage and handling management  
              vi.         WIP management
1.       Storage management and standardization
2.       Clear identification
3.       Proper and well defined WIP flow
b)       IQC – owner:
                i.         Operation work flow and control system (FIFO, IN/OUT, verification/escalation…)
              ii.         Documentation (procedure, WI, check sheet, recording sheet…)
              iii.         Maintenance system
c)       Shop floor centralize material preparation – owner:
                i.         Operation work flow and control system
              ii.         Documentation (procedure, WI, recording sheet, W/O…)
d)       Product specific documentation – owner:
                i.         Product flow chart and control plan
              ii.         PFMEA
              iii.         Daily, weekly, monthly quality performance report
              iv.         Customer complaint and finding feedback (quality alert awareness)
e)       Manufacturing control and monitor system
                i.         SFDC & manual recording – owner:
ii.    PTS (SMT & INS) – owner:
iii.    Line hourly performance tracking – owner:
iv.    Line stop control and escalation tracking – owner:
v.     SPC control and tracking (solder paste height, testing yield performance, machine capability…) – owner:
vi.    SMT material handling and control – owner:
vii.     PCB & MSD management work flow and control system
1.       Documentation (procedure, WI, check sheet)
2.       In / Out control and recording (labeling) – manual and PTS
3.       Dry cabinet machine management, recording & maintenance
4.       Backing oven machine management, recording & maintenance
5.       Focus on humidity & temperature control
g)       SMT printing
                i.         Solder paste material management system from WH ministore and shop floor production – owner:
1.       Procedure, WI, check sheet, recording…
2.       Material allocation (good, bad and engineering sample), handling, FIFO, color & sticker labeling,
3.       Machines (refrigerator, thermometer, thawing machine,…) operation, maintenance and calibration
              ii.         Solder paste viscosity & height measurement system – owner:
1.       Procedure, WI, check sheet, recording (SPC control)
2.       Operation work flow & control
3.       Machines maintenance and calibration
              iii.         Solder paste printing – owner:
1.       Procedure, WI, check sheet, recording…
2.       Solder paste in used management (stir process and life time control on stencil)
3.       Stencil management
a)       Stencil storage (LF/Leaded segregation, IN / OUT control and recording)
b)       Stencil cleaning process, control and machine operation & maintenance
c)       Stencil condition checking method, frequency and recording
4.       Squeegee & vacuum block/support pins management
a)       Different type of squeegee (angle) definition, selection, identification and storage
b)       Squeegee cleaning process and control
c)       Squeegee checking method, frequency and recording
d)       Pls do ensure same checking on vacuum block/support pins
5.       Printing machine management
a)       Printing machine operation, maintenance, calibration and capability study
b)       Printing process parameter setting (match with WI)
c)       Printing process optimization and improvement actions
6.       Board flow direction definition
h)       SMT placement – owner:
                i.         Placement machines type (Fuji CP/IP/QP and Siemens X4/X3)
              ii.         Procedure, WI, check sheet, recording…
              iii.         Placement machine operation, programming, handling, maintenance and capability study
              iv.         Placement machine utilization, downtime and attrition control/recording
                v.         Feeder/nozzle selection, identification, storage, handling and maintenance
              vi.         Special hand place part control and management
i)       SMT reflow soldering – owner:
                i.         Reflow machines
1.       Procedure, WI, check sheet, recording
2.       Reflow machine operation, handling, maintenance and capability study
3.       Reflow parameter setting (match with WI)
4.       Board flow direction definition
              ii.         Reflow profile measurement
1.       Procedure, WI, check sheet, recording
2.       Profile board definition, storage and life span control management (IN/OUT, labeling)
3.       Profiler (datapaq) operation, maintenance and calibration
4.       Profile measurement management, control, frequency and reference data
j)       SMT Inspection checking – owner:
                i.         Visual inspection
1.       Procedure, WI, check sheet, recording and SFDC
2.       Inspection template management, storage (IN/OUT), maintenance and recording
3.       Good & faulty boards handling system
              ii.         AOI
1.       Procedure, WI, check sheet, recording and coverage report…
2.       Machine operation, maintenance, calibration, verification (good/bad samples)
3.       Good & faulty boards handling system
k)       INS & Wave soldering – owner:
                i.         INS
1.       INS operation definition and line balancing
2.       Procedure, WI, check sheet, recording…
3.       Parts management
              ii.         Wave soldering (normal double wave and selective wave)
1.       Machines
a)       Procedure, WI, check sheet, recording
b)       Machine operation, handling, maintenance and capability study
c)       Wave soldering parameter setting (match with WI)
d)       Board flow direction definition
e)       Special focus on
                                            i.         Spray fluxer (or foam fluxer) control setting, air pressure checking and spray condition verification
                                          ii.         Preheat setting
                                          iii.         Wave height and angle checking
                                          iv.         Solder level (min & max) on solder pot checking & solder bar top up
                                            v.         Solder pot temperature measurement
                                          vi.         Solder dross cleaning
                                          vii.         Solder pot content (element) measurement
2.       Profile measurement
a)       Procedure, WI, check sheet, recording
b)       Profile board definition, storage and life span control management (IN/OUT, labeling)
c)       Profile measurement management, control, frequency and reference data
l)       Manual soldering and touch up – owner:
                i.         Manual soldering and touch up operation definition and requirement
              ii.         Procedure, WI, check sheet, recording…
              iii.         Jig/fixtures in used management (operation, verification and maintenance)
              iv.         Soldering iron temperature control and regular checking control system
                v.         Temperature checker calibration
m)     Pressfit process – owner:
                i.         Machine operation, handling, maintenance and capability study
              ii.         Procedure, WI, check sheet, recording…
              iii.         Jig/fixtures in used management (operation, verification and maintenance)
              iv.         Special focus on the parameter setting such as press force, speed, and height setting and verification
                v.         EHS (Environment, Health, Safety) control
n)       V-cut / Router process –owner:
                i.         Machine operation, handling, maintenance and capability study
              ii.         Procedure, WI, check sheet, recording…
              iii.         Jig/fixtures in used management (operation, verification and maintenance)
              iv.         EHS (Environment, Health, Safety) control
o)       Final assembly (mechanical) – owner:
                i.         Final assembly operation definition and requirement
              ii.         Procedure, WI, check sheet, recording…
              iii.         Jig/fixtures in used management (operation, verification and maintenance)
              iv.         Special focus on screw torque control – setting and regular measurement
                v.         EHS (Environment, Health, Safety) control
p)       Conformal coating – owner:
                i.         This is non NSN production process, BUT a request from customer… shall visit to A123 production in potting room
              ii.         Machine operation, handling, maintenance and capability study
              iii.         Procedure, WI, check sheet, recording…
              iv.         Jig/fixtures in used management (operation, verification and maintenance)
                v.         Special focus on air pressure control, measurement and recording
              vi.         EHS (Environment, Health, Safety) control
q)       Rework station (offline rework soldering station and SRT BGA rework room) – owner:
                i.         Rework operation definition and control system
              ii.         Procedure, WI, check sheet, recording…
              iii.         Leaded/LF distinguishing and identification
              iv.         WIP management
                v.         Soldering iron temp measurement, SRT BGA rework profile measurement, X-ray measurement…
              vi.         EHS (Environment, Health, Safety) control
r)       Packing – owner:
                i.         Packing process definition and control system
              ii.         Procedure, WI, check sheet, recording…
              iii.         Special focus on off/in line barcode printing and SN scanning, linkage and fool proof system capability

2.       For Group 2 – Auditee lead by TTT
To TTT, pls list out the check points and any supporting require from each section/dept if needed

3.       For Group 3 – Auditee lead by KKK
To KKK, pls list out the check points and any supporting require from each section/dept especially for below if needed
       FMEA documents (specific product sample)
       DFM/DFT report (specific product sample)
       NPI check sheet (specific product sample)
       NPI & product transfer management sample
       Prototype, pre-pilot, pilot and ramp up build report
       BOM creation & ECN implementation management
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离线nestor
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在线时长:4005小时
升级剩余时间:45小时在线等级:26
在线时长:4005小时
升级剩余时间:45小时在线等级:26
在线时长:4005小时
升级剩余时间:45小时在线等级:26
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只看该作者 沙发  发表于: 2009-09-05
Thanks for sharing, but I ain't sure should auditees need to be lead, which may against the objective for auditing.
离线hnlizw
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只看该作者 藤椅  发表于: 2009-10-05
Usually, our company is use Dell QPA audit check list improve ourselves system;