Indium公司发布新锡膏技术 - BiAgXmFuHZ)iQG BiAgX™ is excellent for small, low-voltage QFN packages that are used in portable electronics (smartphone/tablet), automotive electronics, and industrial applications. It excels in high temperature environments in excess of 150°C. It requires minimal process adjustments and no capital expenditures for customers converting from a standard high Pb-containing solder paste-based process. /}3I:aJwb eOUEhpE 7vB6IF BiAgX™ addresses both customer demands and potential legislative changes that eliminate lead from high-melting die-attach applications. It is both Pb-free and Sb-free (lead and antimony) and does not contain costly specialty materials, such as nanosilver or sintering aids. [ 转自SMT之家论坛 http://bbs.smthome.net ] ?H21Ru>:* xHuw ?4 BiAgX™ reflows, solders, wets, and solidifies just like any other solder paste, and is available in both dispense and printing forms. Fluxes are cleanable with standard cleaning chemistries and processes. l }]"X@&G 1<pb=H For more information about BiAgX™, including technical papers and other technical information, visit www.indium.com/BiAgX. )xYGJq4 [ 转自SMT之家论坛 http://bbs.smthome.net ] uP2Wy3`V Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputtering targets; indium, gallium, and germanium metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA. E5t /-4 p!+bn,?G For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. |
最新评论
-
arfung 2014-02-01 07:56铟泰