[請教]關於RoHS新增豁免條款的解讀 [复制链接]

請問大家, 在2005/747/EC中新增的5項豁免條款分別具體是指哪些產品? 謝謝大家幫忙~~~

11. Lead used in compliant pin connector systems.
12. Lead as a coating material for the thermal conduction module c-ring.
13. Lead and cadmium in optical and filter glass.
14. Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight.
15. Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.

(11)順應針聯接系統中使用的鉛
(12)熱導項槍釘模組涂層中所用的鉛
(13)光學玻璃及濾光玻璃中所用的鉛及鎘
(14)微處理針腳及封裝聯接所使用的含有80-85%鉛的復合(含有超過兩種組分)焊料中的鉛
(15)倒裝芯片封裝中半導體芯片及載體之間形成可靠聯接所用焊料中的鉛

过渡阶段的无奈之举啊，这些LEAD应该不会有多大铅危害吧，最主要的污染愿还是来自电池。。。