==> 明天再上傳!
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where are others? good file
| samnet1 | 2007-11-06 17:33 |
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Intel 英 特 爾 IC 完全手册 ( 英文, 共 15 章 ), 内容包罗万有  , 包括 : => 各种 IC 封装, => IC 的 制造过程 , => IC 电器/ 机械 /热量的 性能 => ESD , => MSL [ Moisture sensitivity Level 潮湿敏感元件级别], => Reflow Profile 温度曲线 , => BGA, CSP....等等 => J-STD-020D IC 潮湿敏感组件 下載 => J-STD-033B.1 湿度敏感表面贴装元器件的处理、包装、运输及使用标准 **************************************************************************** Intel® Packaging Information Packaging Databook Chapter 1: Introduction (PDF 271KB) An overview of package families, including package attributes, package types, and a package selection guide. Chapter 2: Package/Module/PC Card Outlines and Dimensions (PDF 1966KB) 各种 IC 封装  A detailed view into Intel package outlines and dimensions. Chapter 3: Alumina and Leaded Molded Technology & IC Assembly Process (PDF 205KB) IC 的 制造过程 Statistical tools used in the manufacturing process. Also included is a comprehensive analysis of Intel's IC assembly manufacturing technology and process flow. Chapter 4: Performance Characteristics of IC Packages (PDF 747KB) Package characteristics and data for electrical, mechanical, and thermal IC package characteristics. IC 电器/ 机械 /热量的 性能 Chapter 5: Physical Constants of IC Package Materials (PDF 101KB) Physical constants of IC package materials. This chapter provides valuable information onmechanical, electrical, and thermal properties of case materials, lead/leadframes, and solderingmaterial characteristics. Chapter 6: ESD/EOS (PDF 53KB) 静电放电 An overview of electrical static discharge and electrical over stress. ESD/EOS precautions are described. + 最新的 ESD S20.20标准(2007） Chapter 7: Leaded Surface Mount Technology (SMT) (PDF 101KB) SMT 制造过程 分 Type I, Type II, Type III A review of the mass reflow soldering technologies of printed circuit board (PCB) component assembly termed SMT (surface mount technology). Chapter 8: Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs (PDF 269KB) MSL : IC 潮湿敏感组件 6 级 [ MSL= Level 1到MSL =Level=6 ]. Desiccant Packing Methods and Materials. The six levels of moisture sensitivity for packages is also examined. + J-STD-020D [ June.,2007 ] IC 潮湿敏感组件 下載 + J-STD-033B.1 ( with Amend 1, issue on Jan.,2007 ) Standard for Handling, Packing, Shipping, and Use of Moisture/Reflow Sensitive Surface Mount Devices 湿度敏感表面贴装元器件的处理、包装、运输及使用标准 Chapter 9: Board Solder Reflow Process Recommendations - Leaded SMT (PDF 174KB) A review of Board Solder Reflow Process Information. Chapter 10: Shipping and Transport Media (PDF 357KB) Various packing and shipping methods used at Intel. Packing media, desiccant pack materials, and shipping data are illustrated. Chapter 11: International Packaging Specifications (PDF 38KB) A listing of international packaging specifications and a comprehensive resource library. Chapter 12: Tape Carrier Package (PDF 292KB) A profile of the Tape Carrier Package and its uses in areas that require lightweight small footprintintegrated circuits. Chapter 13: Pinned Packaging (PDF 751KB) An overview of Plastic Pin Grid Array package technology, and its physical structure, electrical modeling and performance. Chapter 14: Ball Grid Array (BGA) Packaging (PDF 795KB) A profile of the Plastic Ball Grid Array package technology detailing its physical structure, electrical modeling, performance, and other aspects of the PBGA package. Chapter 15: The Chip Scale Package (CSP) (PDF 212KB) An overview of Chip Scale Packaging Note : The Intel® Packaging Databook is intended to serve only as a data reference guide to Intelpackage selection and availability. As the packaging landscape changes very rapidly, informationcan become outdated very quickly. Please refer to the product specifications on the Products site for the most current detailed package information. |
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